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What we can build, stated as numbers rather than adjectives

Specifications are commercial promises. Rather than publish plausible figures, every parameter below shows either its confirmed value or that we will confirm it against your design.

NoteDetailed parameters are confirmed per enquiry rather than published as a generic sheet. Tell us what your design needs and our engineering team will answer against your actual stack-up, the same day.

PCB Manufacturing

Bare board fabrication from your Gerber or ODB++ output, built and inspected in Midrand.

PCB Assembly

Populated boards — surface mount, through-hole, and mixed technology.

Prototype PCB

Short-run boards for design validation, with an engineer on the phone.

Multilayer PCB

Layer stack-ups for dense, high-speed and reliability-critical designs.

Manufacturing parameters

Construction, feature sizes, materials and finishes.

Construction

Confirmed per enquiry

The physical envelope a design has to fit inside — how many layers, how large, how thick.

Maximum layer count
On enquiry
Maximum board size
On enquiry
Minimum board size
On enquiry
Finished board thickness
On enquiry
Aspect ratioBoard thickness against smallest drilled hole.
On enquiry

Feature sizes

Confirmed per enquiry

The limits that decide whether a dense design routes at all, and the first thing an engineer checks against a fab.

Minimum track width
On enquiry
Minimum gap
On enquiry
Minimum drilled hole
On enquiry
Minimum annular ring
On enquiry
Registration tolerance
On enquiry

Materials

Confirmed per enquiry

Base laminate determines thermal and electrical behaviour, and the sectors CET serves each push it differently.

Standard laminate
On enquiry
High-Tg options
On enquiry
Metal core / aluminium
On enquiry
Flexible and rigid-flex
On enquiry
Copper weights
On enquiry

Finishes

Confirmed per enquiry

Surface finish drives shelf life, solderability and fine-pitch assembly yield.

Surface finishesHASL, lead-free HASL, ENIG, OSP, immersion tin or silver.
On enquiry
Solder mask colours
On enquiry
Silkscreen colours
On enquiry
Controlled impedance
On enquiry
Electrical test
On enquiry

Placement, process and inspection

Bare board and assembly from one supplier removes the handover where responsibility goes missing.

Placement

Confirmed per enquiry

What can be placed, how small, and on how many sides.

Minimum component package
On enquiry
BGA and fine pitch
On enquiry
Single or double sided
On enquiry
Through-hole
On enquiry
Placement accuracy
On enquiry

Process

Confirmed per enquiry

Solder chemistry and batch economics.

Leaded and lead-free
On enquiry
Reflow profiling
On enquiry
Conformal coating
On enquiry
Minimum order quantity
On enquiry
Prototype batch size
On enquiry

Inspection and test

Confirmed per enquiry

For regulated sectors this is the part of the quote that actually matters.

Automated optical inspection
On enquiry
X-ray inspection
On enquiry
In-circuit test
On enquiry
Functional test
On enquiry
IPC class worked toIPC-A-610 class 1, 2 or 3.
On enquiry

Turnaround

Local manufacture removes freight and customs from the schedule. These are the numbers that quantify it.

Lead times

Confirmed per enquiry

Local manufacture removes freight and customs from the schedule. These are the numbers that quantify it.

Prototype turnaround
On enquiry
Standard production
On enquiry
Expedited service
On enquiry
Quotation turnaround
On enquiry
Assembly turnaround
On enquiry

An offshore quote that looks cheaper on unit price frequently is not, once freight, customs clearance, exchange-rate movement and the cost of a two-week feedback loop on a failed prototype are counted.

Quality and process

Where the risk sits at each stage. CET holds no third-party certifications at present; when that changes, the certificates will be published here rather than described.

  1. 01

    Bill of materials review

    The BOM is checked for availability, lifecycle status and footprint agreement with the board.

    A single obsolete line item can stall an entire build.

  2. 02

    Stencil and paste

    Solder paste is applied through a stencil cut to the board’s pad geometry.

    Paste volume drives most reflow defects; too little and joints starve.

  3. 03

    Placement

    Components are placed onto the pasted board.

    Fine-pitch and BGA placement accuracy determines whether X-ray finds anything.

  4. 04

    Reflow

    The assembly passes through a profiled thermal cycle that forms every joint at once.

    An unprofiled oven damages components and starves joints in the same pass.

  5. 05

    Inspection

    Assemblies are inspected for placement, orientation and joint quality.

    Defects caught here cost minutes; the same defect in the field costs a return.

  6. 06

    Test and dispatch

    Boards are tested to the level the customer specifies, then packed and dispatched.

    Test scope should be agreed at quotation, never assumed.

Next step

Ask for the number you need

A parameter marked on enquiry is not a refusal — send your requirement and our engineering team will confirm it against your actual stack-up.

Request a quoteinfo@cetpcb.com

Or call +27 12 665 4860